Control Principles and On-Chip Circuits for Active Cooling Using Integrated Superlattice-Based Thin-Film Thermoelectric Devices
B. Alexandrov, O. Sullivan. W. Song,. S. Yalamanchili, S. Kumar and S. Mukhopadhyay, “Control Principles and On-Chip Circuits for Active Cooling using Integrated Super Lattice Based Thin Film Thermoelectric Devices,” IEEE Transactions on VLSI, vol. 22, no. 9, September 2014.
Abstract
Superlattice thin-film thermoelectric coolers (TECs) are emerging as a promising technology for hot spot mitigation in microprocessors. This paper studies the prospect of on-demand cooling with advanced TECs integrated at the back of the heat spreader inside a package (integrated TEC). Using thermal compact models of the chip and package with integrated TECs, the control principles for TEC-assisted transient cooling are presented. The control principles are implemented in a 130-nm CMOS process and cosimulated with the thermal system to show their feasibility and energy overheads. The simulation results show potential for extending the time for which a chip and package can sustain a high power load.
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Citation
@artical{Alexandrov-vlsi22,
author={B. Alexandrov, O. Sullivan. W. Song,. S. Yalamanchili, S. Kumar and S. Mukhopadhyay},
journal={IEEE Transactions on VLSI},
title={Control Principles and On-Chip Circuits for Active Cooling Using Integrated Superlattice-Based Thin-Film Thermoelectric Devices},
issue_date = {September 2014},
volume = {22},
number = {9},
month = sep,
year = {2014}
}
author={B. Alexandrov, O. Sullivan. W. Song,. S. Yalamanchili, S. Kumar and S. Mukhopadhyay},
journal={IEEE Transactions on VLSI},
title={Control Principles and On-Chip Circuits for Active Cooling Using Integrated Superlattice-Based Thin-Film Thermoelectric Devices},
issue_date = {September 2014},
volume = {22},
number = {9},
month = sep,
year = {2014}
}
