Paper “Power Multiplexing for Thermal Field Management in Many-Core Processors” Selected as the IEEE Transactions on Components, Packaging, and Manufacturing Technology 2013 Best Paper

Posted by on Nov 2, 2014 in News

Paper “Power Multiplexing for Thermal Field Management in Many-Core Processors” Selected as the IEEE Transactions on Components, Packaging, and Manufacturing Technology 2013 Best Paper

The paper “Power Multiplexing for Thermal Field Management in Many-Core Processors” was awarded the best publication in the Components: Characterization and Modeling category. Coauthors are ECE Professors Saibal Mukhopadhyay and Sudhakar Yalamanchili; their graduated ECE Ph.D. students Minki Cho, Chad Kersey, and Nikhil Sathe; ME Assistant Professor Satish Kumar; and Man Prakash Gupta, Kumar’s current ME Ph.D. student.

This team’s paper presented a simple, yet effective approach known as power multiplexing, which periodically migrates the locations of active cores on a chip to redistribute the generated heat. Such spatiotemporal redistribution of power and heat reduces the peak temperature and produces a more uniform thermal field, thus mitigating the negative impact of peak temperatures and thermal gradients on performance and reliability.

Supported by the Semiconductor Research Corporation, Intel Corporation, and an IBM Faculty Award, this work reflects the multidisciplinary approach necessary to solving many critical problems facing the chip industry and demonstrates Georgia Tech’s longstanding commitment to collaborative research.

Congratulations to the team!